SEMICON China 2024
20.03.2024 - 22.03.2024
Shanghai New International Expo Centre
Organizer: SEMI and CECC
SEMI connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities.
SEMICON China Theme Pavilions:
IC Manufacturing Pavilion
Compound Semiconductor Pavilion
SEMI Workforce Pavilion
Smart Mobility Pavilion
Conference of Science & Technology for Integrated Circuits (CSTIC) 2024
Plan now to participate at CSTIC 2024, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE. CSTIC 2024 will be held on March 17-18, 2024 in Shanghai, China, in conjunction with SEMICON China 2024. The conference will have ten symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.
Topics to be addressed at CSTIC 2024 include, but are not limited to the following:
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post CMP Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Symposium X: AI & IC Manufacturing