01.12.2021 - 03.12.2021  (Virtual)

Singapore

 

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by IEEE Electronics Packaging Society (EPS). 

 

CONFERENCE TOPICS

 

Advanced Packaging

TSV/Wafer Level Packaging

Interconnection Technologies

Emerging Technologies

Materials and Processing

Assembly and Manufacturing Technology

Electrical Simulation & Characterization

Mechanical Simulation & Characterization

Thermal Characterization & Cooling Solutions

Quality, Reliability & Failure Analysis

Photonics, Optoelectronics and Displays

Smart Manufacturing and Equipment Technology

 

Full manuscript submission deadline: Sep 30, 2021

 

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