13.09.2022 - 16.09.2022

 Sibiu, Romania

 

THE SINGLE LARGEST SEMICONDUCTOR PACKAGING CONFERENCE IN EUROPE

 

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration in Europe. The conference is organized every two years and is the IEEE-EPS flagship conference in Europe supported by IEEE-EPS in association with IMAPS-Europe.

 

The following topics:

 

• Advanced packaging 

• Materials for interconnects and packaging

• Optoelectronic systems packaging 

• Assembly and manufacturing technologies

• Design tools and modeling 

• Power electronics system packaging

• Advanced technologies for emerging systems 

• Reliability and quality of electronic devices and systems

• Flexible, printed and hybrid electronics 

• RF, mm-wave and THz systems packaging

 

Key Dates along the ESTC 2022 Timeline

 

Abstract submission opens: December 1st, 2021

Abstract submission deadline: February 15th, 2022

Notification of abstract acceptance: March 31st, 2022

Full paper submission deadline: June 15th, 2022

 

Call for Papers

 

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