37th International Conference on Microelectronic Test Structures
24.03.2025 - 27.03.2025
San Antonio, TX, USA
This conference is co-sponsored by the IEEE Electron Devices Society.
Topics
• Design
Methodologies, verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
• Measurement techniques
DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, ESD/LUP, EM. Wafer Level (WLR), etc.
Statistical analysis, variability, throughput increase, smart test strategies, compact modeling
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests, TCAD
• Applications
Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, µ-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices
Abstract submission deadline is October 25, 2024