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Министерство образования Республики Беларусь Nanomeeting - 2011 Микроэлектроника

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Министерство образования Республики Беларусь Nanomeeting - internatiol conference Национальная академия наук Беларуси Государственный комитет по науке и технологиям ВАК - Высшая аттестационная комиссия

The 36th European Conference on Surface Science (ECOSS 36)

28.08.2023 - 01.09.2023
Lodz, Poland
 
 
Conference organized by the University of Lodz.
ECOSS is a well-established annual meeting directed jointly by the Surface Science Division of the International Union for Vacuum Science, Technique and Applications (IUVSTA) and the Surface and Interface Section of the European Physical Society (EPS).
 
The conference provides an excellent opportunity for scientists from Europe and from all over the world to meet and discuss the latest advances in the physics and chemistry of surfaces. Furthermore, it is a forum to discuss the progress of surface science in related innovation fields such as heterogeneous catalysis, organic molecular nano-architectures, two-dimensional materials and graphene, nanoelectronics, bio-nanoscience and functional and energy materials studied both using theoretical and experimental methods.
 
Important dates:
 
Abstract submission open: poster
Registration open
 
 

7-й Международный научно-технический симпозиум «ПОРИСТЫЕ ПРОНИЦАЕМЫЕ МАТЕРИАЛЫ: ТЕХНОЛОГИИ И ИЗДЕЛИЯ НА ИХ ОСНОВЕ»

19.10.2023 - 20.10.2023 
Минск - Раков, Беларусь
 
 
Организатор
 
Институт порошковой металлургии имени академика О.В. Романа
 
Секции симпозиума:
 
1.«Пористые порошковые материалы: теоретические и экспериментальные исследования процессов их получения»;
2.«Проницаемые материалы: свойства, технологии получения»;
3.«Эффективные области использования пористых материалов»;
4. «Новые пористые и проницаемые материалы, оборудование и процессы с их применением».
 
 
 

2023 46th International Spring Seminar on Electronics Technology (ISSE)

10.05.2023 - 14.05.2023
Timisoara, Romania
 
 
Topics of Interest
 
A. New Materials, Components and Processes
B. Thermal Management
C. Advanced Packaging and Interconnection Technologies
D. Testing, Reliability and Quality Management
E. Process Modelling and Simulation
F. Environmental and Ecological Effects in Electronics Technology
G. Nanotechnology, Nanomaterials and Nanoelectronics
H. Signal Integrity and Electromagnetic Compatibility
I. Sensors, Actuators and Microsystems
J. Educational and Information Technologies in Electronics Manufacturing
K. Discrete and Integrated Components
 
 
 

2023 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (COMCAS)

06.11.2023 - 08.11.2023
Tel Aviv, Israel
 
 
In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, and industry experience in a range of key areas i.e., microwaves, communications and sensors, antennas, biomedical engineering, RF and microwave devices and circuits, thermal management and electronic packaging, signal processing and imaging, as well as radar, acoustics and microwave system engineering. In its entirety the event includes a technical program, industry exhibits, and guest presentations from global experts on recent academic and industry advancements.
 
 
 

The 24th European Microelectronics & Packaging Conference and Exhibition

11.09.2023 – 14.09.2023 
Cambridge, UK
 
 
 
Conference Themes
 
Semiconductor Industry Trends
Packaging Technologies
Performance and Reliability
Design & Process Optimisation
Markets and Developments
Integration Materials
Design and Test
 
The deadline for submission is January 13, 2023.
 
 
 

IX International Conference «Engineering & Telecommunication — En&T-2023»

22.11.2023 - 23.11.2023
Dolgoprudny, Russia
 
 
Organizers:
 
Moscow Institute of Physics and Technology (Russia), 
Institute of Electrical and Electronics Engineers IEEE (USA), 
Tsinghua University (China), 
Indian Institute of Information Technology (India),
PhysTech-Union (Russia)
 
Conference Program includes the following sections:
 
Telecommunication technology and IT
Radio communication and radar systems
Computing Technologies and Systems
Artificial intelligence systems
 
 
 
 

8th International Materials Science Conference HighMatTech-2023

02.10.2023 - 06.10.2023 
Kyiv, Ukraine
 
 
Organizers:
 
Frantsevich Ukrainian Materials Research Society, 
Frantsevich Institute for Problems in Materials Science, 
National Technical University of Ukraine “Igor Sikorsky Kyiv Polytechnic Institute”
 
Topics: 
 
Metals and Alloys
Ceramics and Glasses
Composite Materials
Low-dimensional and NanoMaterials
Films and Coatings
 
 
 
 

2023 IEEЕ Ural-Siberian Conference on Biomedical Engineering, Radioelectronics and Information Technology (USBEREIT)

15.05.2023 - 17.05.2023
Yekaterinburg, Russia
 
 
Organizers
 
Institute of Radiolectronics and Information Technologies – RTF, Ural Federal University
 
Topics:
 
Biomedical Engineering
o Devices and Instrumentation Systems for Monitoring and Diagnostics;
o Experimental and Laboratory Equipment;
o Processing of Biomedical Signals and Images;
o Modeling of Biological Processes for Clinic and Laboratory Tasks;
 
Radioelectronics
o Antennas;
o Electromagnetics and Materials;
o Propagation and Scattering;
o Wireless Communications, Sensors and Sensing Networks;
o Microwave Devices;
 
Information Technology
o Data Analysis;
o Data Engineering;
o High-Performance Computing;
o Machine Learning;
 
Information Security
 
 

50th IEEE International Conference on Plasma Science (ICOPS)

21.05.2023 - 25.05.2023
Santa Fe, New Mexico
 
ICOPS is one of the premier plasma physics conferences in the world that covers both traditional areas of plasma science and new exploratory research areas. The conference offers an outstanding forum for scientists and engineers to learn further about some of the greatest advances in plasma science and technology in recent years and to discuss future directions of research.
 
 
 

2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

26.06.2023 - 30.06.2023
Munich, Germany
 
Sponsors: European Physical Society - EPS; IEEE Photonics Society; Optica
 
The CLEO®/Europe-EQEC conference series has established a strong tradition as the largest, most comprehensive and prestigious gathering of optics and photonics researchers and engineers in Europe. More specifically, CLEO®/Europe emphasizes applied physics, optical engineering and applications of photonics and laser technology, whereas EQEC addresses more basic research in laser physics, nonlinear optics and quantum optics. With technical cosponsorship provided by the European Physical Society (EPS), the Institute of Electrical and Electronics Engineers (IEEE) Photonics Society, and the Optica (formely OSA), CLEO®/Europe and EQEC have a strong international presence in the complementary research areas of laser science, photonics and quantum electronics.
 
 
 

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