Каталог включает инновационные технологические предложения, базирующиеся на результатах исследований и разработок, выполненных в рамках основных направлений научно-технической деятельности лабораторий и отделов Института тепло- и массообмена им. А.В. Лыкова НАН Беларуси.

 

Подробно

 

Каталог включает инновационные технологические предложения, базирующиеся на результатах исследований и разработок, выполненных в рамках основных направлений научно-технической деятельности лабораторий и отделов Физико-технического института НАН Беларуси.

Подробно

 

01.12.2021 - 03.12.2021  (Virtual)

Singapore

 

The 23rd IEEE Electronics Packaging Technology Conference (EPTC2021) is an international event organized by the IEEE RS/EPS/EDS Singapore Chapters and co-sponsored by IEEE Electronics Packaging Society (EPS). 

 

CONFERENCE TOPICS

 

Advanced Packaging

TSV/Wafer Level Packaging

Interconnection Technologies

Emerging Technologies

Materials and Processing

Assembly and Manufacturing Technology

Electrical Simulation & Characterization

Mechanical Simulation & Characterization

Thermal Characterization & Cooling Solutions

Quality, Reliability & Failure Analysis

Photonics, Optoelectronics and Displays

Smart Manufacturing and Equipment Technology

 

Full manuscript submission deadline: Sep 30, 2021

 

Подробно

 

07.10.2021 - 08.10.2021

Riga, Latvia

 

 

Name of the organization:

 

IEEE Latvia Section Communications, Microwave Theory and Techniques, and Antennas and Propagation Joint Societies Chapter

Riga Technical University

IEEE Latvia section

Ventspils International Radio Astronomy Centre

Vilnius Gediminas Technical University

University of Applied Sciences Lübeck

Tallinn University of Technology

Hochschule Wismar, University of Applied Sciences, Technology, Business and Design

 

Topics:

 

Wireless Communications

 

PHY techniques

MIMO techniques

Wireless Power Transfer and Energy Harvesting

Software-defined radio and cognitive radio

Regulatory issues

Ad-hoc and cell-based networking

Network technologies, architectures

Channel coding

Signal processing

Sensor networks and IoT

5G Mobile Technology

Optical communications

 

Microwave Theory and Techniques

 

Antennas

Microwave Photonics

Microwave Electronics

Materials

Applications

Passive components, circuits and subsystems

Active components, circuits and subsystems

Sub-THz and THz Components

Electromagnetic Field Theory and Numerical Techniques

Measurement Techniques and Systems

 

Important dates

Paper submission due: August 23, 2021

Notification to authors: September 13, 2021

 

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23.11.2022 - 24.11.2022

Dolgoprudny, Russia

 

Organizers

 

Moscow Institute of Physics and Technology (Russia) supported by Huawei Technologies Co. Ltd. company (China), Competence Center of Artificial Intelligence (Russian National Technological Initiative), Institute of Electrical and Electronics Engineers IEEE (USA), Tsinghua University (China), Dalian University of Tecnology (China), Indian Institute of Information Technology (India) and PhysTech-Union (Russia) 

 

Conference Program includes the following sections:

 

Telecommunication technology and IT

Radio communication and radar systems

Computing Technologies and Systems

Artificial intelligence systems

 

Подробно

 

22.09.2022 - 23.09.2022

Saratov, Russia 

 

Organizers:

 

Yuri Gagarin State Technical University of Saratov

IEEE Russia Sec MTT/ED/AP/CPMT/NPS Saratov Jt. Chapter

 

Conference Topics:

 

Microwave Electronics;

Vacuum Microelectronics and Nanoelectronics;

Microwave Theory and Techniques;

Technologies;

Power Electronics;

Applications of Electron Devices.

 

Deadlines APEDE’ 2022

 

Submission of paper July, 15, 2022

Notification of acceptance July, 20, 2022

Final paper submission July, 25, 2022

Registration August, 01, 2022

 

Подробно

 

17.03.2022 - 19.03.2022

Russia, Moscow

 

 

The conference is supported by:

 

Moscow Power Engineering Institute, National Research University, Moscow, Russian Federation

Skoltech IEEE Student Branch, Skolkovo Institute of Science and Technology, Moscow, Russian Federation

 

The conference is technically co-sponsored by:

 

 IEEE Industry Applications Society (IEEE IAS)

 

Conference fields of interest

 

Power, Energy, and Industry Applications;

Components, Circuits, Devices, and Systems;

Computing and Processing;

Engineering Profession;

Fields, Waves, and Electromagnetics;

General Topics for Engineers;

Signal Processing and Analysis;

Transportation.

 

Сборник тезисов

 

Подробно

 

18.10.2021 – 21.10.2021  in a virtual format

 

 

IEEE Photonics Society

 

TOPICS

 

TECHNOLOGIES

 

Nanophotonics (NANO)

Optical Micro / Nano Resonators and Devices (OMND)

Semiconductor Lasers and Sources (SLS)

Photodetectors, Sensors and Imaging (PSS)

Nonlinear and Ultrafast Optics (NLUO)

Photonic Materials, Processes, Integration and Packaging (PPIP)

 

APPLICATIONS

 

Optical Communications and Networks (OCN)

Optical Fiber Technology (OFT)

Optical Interconnects (OI)

Quantum Photonic Information Technologies (QPIT)

Microwave Photonics & Avionics / Vehicle Fiber-Optics & Photonics (MWP-AVFOP)

Biophotonics and Optics (BIPO)

 

SPECIAL SYMPOSIA

 

Special Symposium on Deep Tissue Imaging and Quantum Sensing (SS DT-QS)

Special Symposia on Machine Learning and Photonics (SS on MLP)

Special Symposium on Ultrafast Mid-infrared Laser Sources and Applications (SS UMLSA)

 

Подробно

 

Организаторы:

Национальная академия наук Беларуси,  

Национальная академия наук Украины  

 

Конкурс проводится в следующих научных областях:

 

- физика;

- биологические науки, биотехнологии (в том числе медицинские);

- новые вещества и материалы.

 

Конкурс отменён

 

Подробно

 

 

09.11.2021 - 12.11.2021

Moscow, Russia 

 

 

It is organized by the Russian Quantum Center

 

Scientific Directions

 

QUANTUM CRYPTOGRAPHY

QUANTUM OPTICS

QUANTUM INFORMATION

QUANTUM TECHNOLOGIES

 

Please note that due to the pandemic this year the number of participants is limited to 75 people. The selection of students will be carried out by the organizing committee of the school on the basis of the submitted application.

 

 

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