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Министерство образования Республики Беларусь Nanomeeting - 2011 Микроэлектроника

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Министерство образования Республики Беларусь Nanomeeting - internatiol conference Национальная академия наук Беларуси Государственный комитет по науке и технологиям ВАК - Высшая аттестационная комиссия

2025 Conference on Lasers and Electro-Optics/Europe

23.06.2025 – 27.06.2025 
Munich, Germany
 
 
Organized by EPS, Optica and IEEE Photonics Society
 
International conference to highlight new frontiers in lasers, photonics and optical science across a wide range of technical areas.
The CLEO®/Europe-EQEC conference series has a strong tradition as a comprehensive and prestigious gathering of optics and photonics researchers and engineers in Europe.
With technical co-sponsorship provided by the European Physical Society (EPS), the IEEE Photonics Society (IPS) and the Optica, CLEO®/Europe reflects a strong international presence in the complementary research traditions of laser science, photonics and quantum electronics.
 
2025 World of Photonics Congress
 
The World of Photonics Congress bundles various topical conferences under one roof under the organization by Messe München International. It is a strategic and operative umbrella for various individual conferences held by leading associations and organizations:
 
Conference on Lasers and Electro-Optics®/Europe – European Quantum Electronics Conference (CLEO®/Europe-EQEC Conference) – organised by EPS, Optica, IEEE Photonics Society
European Conferences on Biomedical Optics (ECBO) – organised by Optica, SPIE
Optical Metrology organised by SPIE Europe.
Digital Optical Technology organised by SPIE Europe.
LiM 2025 – Lasers in Manufacturing – organised by WLT
 
For more detailed information concerning the various conferences please consult: http://www.photonics-congress.com/
 
 

37th International Conference on Microelectronic Test Structures

24.03.2025 - 27.03.2025
San Antonio, TX, USA
 
 
This conference is co-sponsored by the IEEE Electron Devices Society.
 
Topics
 
• Design
 
Methodologies, verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
 
• Measurement techniques
 
DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, ESD/LUP, EM. Wafer Level (WLR), etc.
Statistical analysis, variability, throughput increase, smart test strategies, compact modeling
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests, TCAD
 
• Applications
 
Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, µ-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices
 
Abstract submission deadline is October 25, 2024
 
 
 

The 9th IEEE Electron Devices Technology and Manufacturing (EDTM 2025) Conference

09.03.2025 - 12.03.2025
Hong Kong, China
 
 
EDTM 2025 will be a full four-day conference, established and sponsored by the IEEE Electron Devices Society (EDS). It is a premier conference, which aims to bring together experts/researchers from industry and  academia around the world on a common platform, to showcase new discoveries and discuss on a broad range of topics covering semiconductor device technology and manufacturing.
 
Topics for IEEE EDTM 2025
 
1. Materials
2. Process, Tools, Yield, and Manufacturing
3. Advanced Semiconductor (Logic) Devices
4. Memory Technologies
5. Photonics, Imaging and Display
6. Wide-Bandgap Power and RF Devices
7. Modeling and Simulation
8. Reliability and testing
9. Packaging and Heterogenous Integration
10. Sensor, MEMS, Bio-electronics
11. Flexible and Wearable Electronics
12. Nanotechnologies
13. Disruptive Technologies
 
Paper Submission Deadline October 31, 2024
 
 
 

The “6th International Conference on Nanomaterials, Nanofabrication and Nanocharacterization (NANOMACH)”

08.04.2025 - 14.04.2025 
Mugla, Turkey
 
Topics:
 
Workshop1 (W1) Material Properties and Applications
Workshop2 (W2) Nanofabrication
  Thin film Deposition Techniques
  Lithographic Techniques
  Etching techniques
Bottom-Up
Workshop3 (W3) Nanochacterization
 
 
 

Materials Today Conference 2025

23.06.2025 - 26.06.2025 
Sitges, Spain
 
 
The Materials Today Conference 2025 is organised by Elsevier in association with the Materials Today journals.
 
 A comprehensive three-day program will be focused on the following four key areas:
 
(a) Materials for Electronics and Quantum
(b) Materials for Energy and Sustainability
(c) Structural Materials
(d) Materials for Health
 
Submit abstracts by 31 January 2025 
 
 

35th Anniversary World Congress on Biosensors (Biosensors 2025)

19.05.2025 - 22.05.2025  
Lisbon, Portugal
 
 
Organisers
 
Biosensors 2025 is organised and sponsored by Elsevier / Biosensors & Bioelectronics
 
Topics will include:
 
Bioelectronics (including biocomputing, bio-fuel and photovoltaic cells, and electronic noses)
Commercial biosensors, manufacturing and markets
Nucleic acid-based sensors and aptasensors
Enzyme-based biosensors
Immunosensors
Lab-on-a-chip, multiplexed and multimodal sensors
Microfluidics and immobilisation technology
Wearable biosensors and personal mobile health
Nanobiosensors, nanomaterials & nanoanalytical systems
Natural & synthetic receptors (including MIPs)
Organism-, whole cell- and organ-based biosensors
Printed biosensors and microfabrication
Proteomics, single-cell analysis and cancer-cell detection
Signal transduction technology
Single molecule detection
Theranostics, implantable, ingestible and resorbable sensors
CRISPR-based biosensors
Novel transducers
Synthetic biology for biosensors
AI and machine learning in biosensors
 
Submit abstracts by 8 November 2024
 
 

8th International Conference on Multifunctional, Hybrid and Nanomaterials

03.03.2025 - 06.03.2025 
Montpellier, France
 
 
Organisers
 
This conference is organised by the Elsevier Materials Science Team.
 
Topics:
 
- Biohybrids, biomaterials and biological materials
- Functional hybrid nanomaterials, nanocomposites and their applications
- Functional porous materials
- Energy and sustainability 
 
Submit abstracts by 1 November 2024
 
 

The International Conference on Microelectronics 2024

14.12.2024 - 17.12.2024
DOHA, QATAR
 
 
The IEEE International Conference on Microelectronics has already been held numerous times in different countries across the MiddleEast, Southern Europe, and Asia for the past 32 years.
 
The 36th edition of the conference will take place in Qatar Arab Emirates. IEEE-ICM 2024 will include oral, poster sessions and tutorials given by experts on state-of-the-art topics. The regular technical program will run for three days. In addition, tutorial sessions will be held on the first day of the conference.
 
The IEEE Circuits and Systems Society is the leading organization that promotes the advancement of the theory, analysis, computer-aided design and practical implementation of circuits, and the application of circuit theoretic techniques to systems and signal processing.
 
The Society brings engineers, researchers, scientists and others involved in circuits and systems applications access to the industry’s most essential technical information, networking opportunities, career development tools, and many other exclusive benefits.
 
 
 

The 25th European Microelectronics & Packaging Conference (EMPC 2025)

16.09.2025 - 18.09.2025
Grenoble, France
 
 
 
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
 
The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
 
 
Advanced Packaging and System-Integration
 
System in Package
IC Packaging
Interconnection Technologies
Optoelectronics
 
Specialised Topics
 
Power Electronics
Medical Electronics
Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.
Green Electronics and Sustainability
 
Materials and Processes
 
Materials
Substrate Technologies
Assembly & Manufacturing
Emerging Technologies
Smart manufacturing
 
Design, Modelling and Reliability
 
Design, Modelling and Simulation
Inspection and Test
Quality and Reliability
 
Markets and Developments
 
Markets
Business Aspects
Education for Electronics
 
Deadline for abstract submission is January 27, 2025
 
 
 
 

2025 IEEE 5th International Conference on Smart Information Systems and Technologies (SIST)

14.05.2025 - 16.05.2025 
Astana, Kazakhstan
 
 
2025 IEEE 5th International Conference on Smart Information Systems and Technologies (SIST) topics include, but are not limited to, the following research areas: Technology and Engineering Management, Governance, Finance, and Economy; IT in Education and Research; Emerging Trends and Technologies in IT Application; Data Science and Advanced Analytics.
The conference will be technically co-sponsored by IEEE Ukraine Section, IEEE Kazakhstan Sub-Section and IEEE Kazakhstan CIS/RA Societies Joint Chapter. 
 
 
IMPORTANT DATES
Paper Submissions Deadline 2025-02-13
 
Programme 2024
 
 

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