The 25th European Microelectronics & Packaging Conference (EMPC 2025)
16.09.2025 - 18.09.2025
Grenoble, France
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
Advanced Packaging and System-Integration
System in Package
IC Packaging
Interconnection Technologies
Optoelectronics
Specialised Topics
Power Electronics
Medical Electronics
Bio-medical applications, medical devices; Biosensors and bioelectronics; Complying with material and test regulations, and market requirements; Medical imaging.
Green Electronics and Sustainability
Materials and Processes
Materials
Substrate Technologies
Assembly & Manufacturing
Emerging Technologies
Smart manufacturing
Design, Modelling and Reliability
Design, Modelling and Simulation
Inspection and Test
Quality and Reliability
Markets and Developments
Markets
Business Aspects
Education for Electronics
Deadline for abstract submission is January 27, 2025