EuroSimE 2026. 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
19.04.2026 – 22.04.2026
Warsaw, Poland
The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems.
Important Dates
Deadline abstract submission: extended until November 11, 2025