SEMICON China 2027
24.03.2027 - 26.03.2027
Shanghai New International Expo Centre
Organizer: SEMI and CECC
SEMI connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities.
Theme Pavilions
IC Manufacturing
Compound
SEMI Workforce
Smart Mobility
March 21.03.2027 - 23.03.2027
Shanghai, China
Plan now to participate at CSTIC 2027, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE.
The conference will have ten symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.
Topics to be addressed at CSTIC 2027 include, but are not limited to the following:
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film and Plating
Symposium V: CMP and Cleaning
Symposium VI: Metrology, Defect Inspection, Reliability and Testing
Symposium VII: Advanced Packaging and Process Integration
Symposium VIII: Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Symposium X: AI & IC Manufacturing
Abstract Submissions Deadline: September 30, 2026